IPC Standards Summary - PCB Design, Fabrication, and Assembly Related

Number

J-STD-001E
IPC-D-275
IPC-D-356B
IPC-NC-349
IPC-DR-572
IPC-A-600H
J-STD-609
IPC-A-610E
IPC-SM-782
IPC-SM-840E
IPC-1066
IPC-2141
IPC-2152
IPC-2221
IPC-2222
IPC-2223
IPC-2224
IPC-2252
IPC/JPCA-2315
IPC-2615
IPC-4101C
IPC/JPCA-4104
IPC-4202
IPC-4203
IPC-4552
IPC-4553
IPC-4554
IPC-4562A
IPC-4781
IPC-5704
IPC-6012C
IPC-6013
IPC-6016
IPC-6018
IPC-7351B
IPC-7525B
IPC-9252A

Description

Requirements for Soldered Electrical and Electronic Assemblies
Superseded by IPC-2221/2222
Bare Board Electrical Test Information in Digital Form
Computer Numerical Control Formatting for Drillers and Routers
Drilling Guidelines for Printed Boards
Acceptability of Printed Boards
Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb) Pb-Free and Other Attributes and Devices
Acceptability of Electronic Assemblies
Surface Mount Design and Land Pattern Standard, Superceeded by IPC-7351
Qualification and Performance of Permanent Polymer Coating (Solder Mask) for Printed Boards
Labeling of PCBs and Assemblies
Controlled Impedance Circuit Boards and High Speed Logic Design
Standard for Determining Current Carrying Capacity in Printed Board Design
Generic Standard on Printed Board Design
Sectional Design Standard for Rigid Organic Printed Boards
Sectional Design Standard for Flexible Printed Boards
Sectional Standard for Design of PWBs for PC Cards
Design and Manufacturing Guide for RF/Microwave Circuit Boards
Design Guide for High Density Interconnects (HDI) and Microvia
Printed Board Dimensions and Tolerances
Specification for Base Materials for Rigid and Multilayer Boards
Specification for High Density Interconnect (HDI) and Microvia Materials
Flexible Base Dielectrics for Use in Flexible Printed Wiring
Adhesive Coated Dielectric Films for Use as Cover Sheets
Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards
Specification for Immersion Silver Plating for Printed Circuit Boards
Specification for Immersion Tin Plating for Printed Circuit Boards
Metal Foil for Printed Wiring Applications
Qualification and Performance Specification of Permanent, Semi-Permanent and Temporary Legend and/or Marking Inks
Cleanliness Requirements for Unpopulated Printed Boards
Qualification and Performance Specification for Rigid Printed Boards
Qualification and Performance Specification for Flexible Printed Boards
Qualification and Performance Specification for High Density Interconnect (HDI) Layers or Boards
Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
Generic Requirements for Surface Mount Design and Land Pattern Standard
Guidelines for Stencil Design
Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards

Category

Assembly (Soldering)
Obsolete/Superceeded
Fabrication (Testing)
Fabrication (Drilling)
Fabrication (Drilling)
Fabrication (Inspection)
RoHS
Assembly (Inspection)
Obsolete
Fabrication (Soldermask)
Fabrication/Assembly
Design (High-Speed)
Design (Generic)
Design (Generic)
Design (Rigid)
Design (Flex)
Design (PC Cards)
Design/Fabrication (RF)
Design (HDI)
Design (Drafting)
Fabrication (Rigid)
Material (HDI)
Fabrication (Flex)
Fabrication (Flex)
Fabrication (Plating)
Fabrication (Plating)
Fabrication (Plating)
Fabrication (Material)
Fabrication (Silkscreen)
Fabrication (Cleaning)
Design (Rigid)
Design (Flex)
Design (HDI)
Design (RF)
Design (Library)
Design/Assembly
Fabrication (Test)
Complete List of IPC Standards and Revisions
http://www.ipc.org/4.0_Knowledge/4.1_Standards/revstat1.htm

Electrical Standards - coming soon
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